Enermax TC5121c High Performance Compound Heatsink Paste 3 Gram

Description

Applicator Tool Included
FEATURES & BENEFITS
Optimized polymer matrix to help reduce pump out
Flowable
Good thermal conductivity
Low thermal resistance
Non-curing, no need for curing ovens
Heat removal from electronics components
Can achieve thin Bond Line Thickness (BLT)
THERMAL CONDUCTIVITY
Thermal Resistance
Viscosity
SPECIFIC
GRAVITY
Thixotropy
NVC
(Non Volatile Content)
Dielectric Strength
USABLE TEMPERATURE RANGE
Volume
Part #
Color
W/mk
K/W
Pa-sec (pas)
cP
%
kV/mm
Volts/mil
(°C)
ETC521
Grey
6.1
0.09
79
79000
4.0
1.69
99.93
1.89
47.3
-40°C ~ 120°C
3g